High Performance Low Power BR/BLE 5.2 SoC YC1011-T SOP16
Price 10.0 USD ($)/ Piece
High Performance Low Power BR/BLE 5.2 SoC YC1011-T SOP16 Specification
- Response Time
- Low latency, <10ms (BLE typical)
- Output
- Digital Output, BLE/Bluetooth RF Signal
- Interface
- UART, I2C, SPI, PWM, GPIO
- Sensors Specification
- External sensor interfaces supported via I2C/SPI
- Processor Speed
- 32-bit MCU, up to 48MHz
- Components
- 1 x YC1011-T SoC in SOP16 package
- Power Source
- External DC supply
- Power Supply
- DC
- IP Rating
- Not rated
- Features
- Support for Bluetooth 5.2, BLE & BR/EDR, ultra-low power consumption, secure encryption
- Operating Temperature
- -40C to +85C
- Usage
- Bluetooth-enabled devices, IoT modules, wireless communication
- Thermal Conductivity
- Standard IC dissipation
- Input
- Digital/Analog Input via GPIOs
- Product Type
- Bluetooth BR/BLE SoC
- Application
- Bluetooth Modules, Smart Home, IoT, Wearables
- Rated Voltage
- 3.3V
- Supply Voltage
- 1.8V to 3.6V
- Size
- SOP16 Package
- Dimension (L*W*H)
- 10.3mm x 7.5mm x 1.8mm
- Function
- High Performance Low Power Bluetooth Radio (BR/BLE) SoC
- Color
- Black
- Weight
- 1.2g (typical)
- Capacity
- 256KB Flash, 48KB SRAM
- Current Rating
- Peak RX: 8.2mA; Peak TX: 8.6mA
- Thickness
- 1.8mm (approximate)
- Frequency
- 2.4GHz ISM Band
- Lead-free
- Yes
- Receiver Sensitivity
- -97 dBm (BLE) typical
- MTBF
- >1,000,000 hours
- Development Support
- SDK and Reference Designs available
- Firmware Upgrade
- Supports OTA (Over-the-Air) updates
- Transmit Power
- +4 dBm max
- RoHS Compliance
- Yes
- Package Type
- SOP16
- Security Features
- AES-128 Encryption, Secure Boot
- RoHS Status
- Compliant
- Serial Number
- YC1011-T
- Bluetooth Version
- BR/EDR + BLE 5.2 compliant
- GPIOs
- Up to 16 programmable GPIOs
- Antenna Interface
- On-chip Balun, External antenna supported
High Performance Low Power BR/BLE 5.2 SoC YC1011-T SOP16 Trade Information
- Minimum Order Quantity
- 1 Piece
- FOB Port
- Shenzhen
- Payment Terms
- Telegraphic Transfer (T/T)
- Supply Ability
- 5000000 Pieces Per Month
- Delivery Time
- 1 Week
- Sample Available
- No
- Sample Policy
- Contact us for information regarding our sample policy
- Packaging Details
- 3000 pcs per package
- Main Export Market(s)
- Central America, North America, South America, Eastern Europe, Western Europe, Asia, Australia, Africa, Middle East
- Main Domestic Market
- All India
- Certifications
- ROHS
About High Performance Low Power BR/BLE 5.2 SoC YC1011-T SOP16
Advanced Connectivity for Next-Gen Applications
The YC1011-T SoC brings robust Bluetooth 5.2 support, both BR/EDR and BLE modes, to a wide array of applications. Its flexible antenna interface, extensive GPIO availability, and reliable wireless performance allow seamless integration into smart home products, IoT modules, and wearables. Whether in consumer electronics or industrial solutions, its versatility delivers trusted, high-quality Bluetooth communication.
Secure and Reliable Wireless Communication
Outfitted with AES-128 encryption and a secure boot process, the YC1011-T prioritizes data protection. This robust security ensures safe operation for sensitive applications, while RoHS compliance and a lead-free build demonstrate its eco-friendly design. The long MTBF underscores proven dependability, making it suitable for mission-critical deployments.
Developer-Friendly and Easily Customizable
The SOP16 package design incorporates up to 16 programmable GPIOs, support for digital/analog inputs, and interface options like UART, I2C, SPI, and PWM. Comprehensive SDKs, OTA firmware updates, and reference designs accelerate development and deployment, fostering innovation for developers and manufacturers alike.
FAQ's of High Performance Low Power BR/BLE 5.2 SoC YC1011-T SOP16:
Q: How can I integrate the YC1011-T SoC into my IoT or Bluetooth-enabled device?
A: The YC1011-T supports integration via standard interfaces such as UART, I2C, SPI, PWM, and up to 16 GPIOs. Its SOP16 package and external sensor support (I2C/SPI) make it straightforward to embed in custom hardware designs. Developers can use the provided SDK and reference designs for efficient implementation.Q: What power supply requirements and voltage range does the YC1011-T operate within?
A: The device operates on a DC power supply with a rated voltage of 3.3V and supports a supply voltage range between 1.8V and 3.6V, making it suitable for battery-powered and embedded applications with variable power sources.Q: When should I utilize the OTA firmware update capability of the YC1011-T?
A: OTA (Over-the-Air) firmware upgrades are recommended whenever new features, patches, or security updates are available. This feature allows remote updating of devices post-deployment, minimizing downtime and ensuring seamless operation without requiring physical access.Q: Where is the YC1011-T most beneficially applied?
A: The YC1011-T excels in Bluetooth modules, smart home devices, IoT applications, and wearables, especially where low power consumption and reliable wireless connectivity are priorities. Its extended temperature range and strong RF performance make it suitable for both consumer and industrial environments.Q: What are the key benefits of using the YC1011-T for wireless communication?
A: With Bluetooth 5.2 compliance, low power operation, robust AES-128 security, and flexible hardware interfaces, the YC1011-T ensures efficient, secure, and dependable connectivity. Its OTA update support and long-life MTBF further enhance device life cycle management and reduce maintenance overhead.Q: How does the YC1011-T address security concerns in wireless applications?
A: The SoC includes AES-128 encryption and secure boot features, providing encrypted communication and protection against unauthorized firmware changes. This focus on security helps safeguard data and ensures device trustworthiness in connected environments.Q: What process should be followed to leverage development support for the YC1011-T?
A: Begin by accessing the vendor-provided SDK and reference designs, which offer project templates, libraries, and documentation. This streamlines hardware and firmware integration, and enables rapid prototyping, reducing time to market for your Bluetooth-enabled solution.
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