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IC HS8.1S
IC HS8.1S

IC HS8.1S

Price 5.0 INR/ Piece

MOQ : 200 Pieces

IC HS8.1S Specification

  • Test
  • AOI
  • Min. Line Spacing
  • 1 Millimeter (mm)
  • Soldermask
  • Brown
  • Min. Line Width
  • 1 Millimeter (mm)
  • Impedance
  • 5 Statampere (sA)
  • Voltage Endurance
  • 5 Milliamperes (mA)
  • Hole Size
  • 1 Millimeter (mm)
  • Board Type
  • Other
  • Flame Resistance Level
  • 5
  • Insulation Resistance
  • 5
  • Silkscreen
  • Black
  • Product Type
  • IC
  • Power Rating
  • 5
  • Base Material
  • Alumunium
  • Surface Finish
  • Lead Free
  • Copper Thickness
  • 1 Millimeter (mm)
  • Board Thickness
  • 2 Millimeter (mm)
  • Color
  • Black
  • Panel Size
  • SOP16
  • Sensor Switch
  • Yes
  • Rated Voltage
  • 3 Milliamperes (mA)
  • Electrical Components
  • Yes
  • Usage & Applications
  • 3
  • Operating Temperature
  • 32 Rankine
  • Cable Type
  • USB
  • Number Of Layers
  • 3 Layer
  • Warranty
  • 12 months
  • Display Type
  • 3
  • Phase
  • 4
  • Conductor
  • 4
  • Material
  • copper
  • Features
  • 5
  • Rated Current
  • 5 Statampere (sA)
  • Frequency
  • 5 Hertz (HZ)
 
 

About IC HS8.1S

1. USB 2.0 high-speed HUB controller chip, embedded with a RISC-like processor, used to operate internal control/status registers and respond to commands from the USB host.
2. The design of HS8.1 aims to minimize the use of peripheral components and BOM costs, and optimizes the pin layout to support single-sided and no-crossover board layouts, effectively reducing the production cost of the solution.
3. Currently widely used in computer accessories, Android phone accessories, and iPhone accessories.
4. Fully compatible with USB2.0 standard, and backward compatible with USB1.1 standard.
5. USB2.0 HUB main control IC, driver-free, crystal-free.
6. When used with FE8.1, there is no need to draw a board for PIN-to-PIN connection. It can be used directly after being mounted on the board
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