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Mw7299 Usb2.0 Pd+hub Ic Qfn32-4x4 Application: Usb Hub
Price 5.0 USD ($)/ Piece
MOQ : 1 Piece
Mw7299 Usb2.0 Pd+hub Ic Qfn32-4x4 Application: Usb Hub Specification
- Test
- 100% E-test
- Insulation Resistance
- >500 M
- Board Type
- SMT (Surface Mount)
- Voltage Endurance
- 250V AC for 60s
- Soldermask
- Black
- Silkscreen
- White
- Hole Size
- 0.25mm (Min)
- Impedance
- Control within 10%
- Min. Line Spacing
- 0.1mm
- Flame Resistance Level
- UL94 V-0
- Min. Line Width
- 0.1mm
- Product Type
- USB2.0 PD+HUB IC
- Base Material
- FR4 Epoxy Glass
- Surface Finish
- ENIG (Electroless Nickel/Immersion Gold)
- Copper Thickness
- 35m (1oz)
- Board Thickness
- 1.6mm
- Color
- Black
- Panel Size
- QFN32-4x4
- Electrical Components
- Integrated Circuit
- Number Of Layers
- Single Layer
- Application
- USB Hub, Data Communication
- Power Delivery Version
- PD2.0/3.0 Compatible
- Lead-Free
- Yes
- Package Type
- QFN32, 4x4mm
- Operating Temperature Range
- -40C to +85C
- USB Port Support
- Up to 4 downstream ports
- Interface
- USB 2.0 & Power Delivery (PD)
- Mounting Type
- Surface Mount
- IC Model Number
- MW7299
- Operating Voltage
- 3.3V
- RoHS Compliant
- Yes
- Data Transfer Rate
- 480 Mbps (High Speed)
Mw7299 Usb2.0 Pd+hub Ic Qfn32-4x4 Application: Usb Hub Trade Information
- Minimum Order Quantity
- 1 Piece
- FOB Port
- Shenzhen
- Payment Terms
- Telegraphic Transfer (T/T)
- Supply Ability
- 50000000000 Pieces Per Month
- Delivery Time
- 1 Week
- Sample Available
- No
- Sample Policy
- Contact us for information regarding our sample policy
- Packaging Details
- 4000 pcs per package
- Main Export Market(s)
- Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
- Main Domestic Market
- All India
- Certifications
- ROHS
About Mw7299 Usb2.0 Pd+hub Ic Qfn32-4x4 Application: Usb Hub
A RISC like processor is embedded to operate the internal control/status registers and respond to the commands of the USB host. The MW7299 is designed to minimize the cost of peripheral components and BOM, and optimize the pin layout to support single-sided and no jumper layout, effectively reducing the production cost of the scheme. At present, it is widely used in computer accessories, mobile phone accessories and Apple mobile phone accessories.
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