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USB 2.0 HUB chip OTG adapter chip Android Apple OTG peripheral chip HS8845B CPC-16
USB 2.0 HUB chip OTG adapter chip Android Apple OTG peripheral chip HS8845B CPC-16

USB 2.0 HUB chip OTG adapter chip Android Apple OTG peripheral chip HS8845B CPC-16

Price 4.0 INR/ Piece

MOQ : 1 Piece

USB 2.0 HUB chip OTG adapter chip Android Apple OTG peripheral chip HS8845B CPC-16 Specification

  • Test
  • 100% E-Tested
  • Voltage Endurance
  • 500V AC/Min
  • Min. Line Width
  • 0.1mm
  • Hole Size
  • 0.3mm
  • Insulation Resistance
  • >10^12
  • Impedance
  • 50
  • Soldermask
  • Green
  • Min. Line Spacing
  • 0.1mm
  • Flame Resistance Level
  • 94V-0
  • Silkscreen
  • White
  • Board Type
  • Single-Sided
  • Product Type
  • USB 2.0 HUB Chip, OTG Adapter Chip
  • Base Material
  • FR-4
  • Surface Finish
  • HASL
  • Copper Thickness
  • 1oz
  • Board Thickness
  • 1.6mm
  • Color
  • Green
  • Panel Size
  • Standard
  • Sensor Switch
  • Yes
  • Electrical Components
  • Integrated Circuit
  • Number Of Layers
  • 2 Layers
  • Application
  • Mobile, Tablet, PC peripheral expansion
  • Package
  • CPC-16
  • Operating Temperature
  • -40C to +85C
  • RoHS Compliant
  • Yes
  • Data Transfer Rate
  • Up to 480Mbps
  • Mount Type
  • SMD
  • OTG Compatibility
  • Android and Apple devices
  • ESD Protection
  • 8kV (contact), 15kV (air)
  • Pin Count
  • 16 pins
  • Protocol Support
  • USB 2.0 High-Speed
  • Chip Model
  • HS8845B
  • Supply Voltage
  • 3.3V/5V
 

USB 2.0 HUB chip OTG adapter chip Android Apple OTG peripheral chip HS8845B CPC-16 Trade Information

  • Minimum Order Quantity
  • 1 Piece
  • FOB Port
  • Shenzhen
  • Payment Terms
  • Telegraphic Transfer (T/T)
  • Supply Ability
  • 5000000 Pieces Per Month
  • Delivery Time
  • 1 Week
  • Sample Available
  • No
  • Sample Policy
  • Contact us for information regarding our sample policy
  • Packaging Details
  • 4000 pcs per package
  • Main Export Market(s)
  • Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
  • Main Domestic Market
  • All India
  • Certifications
  • ROHS
 

About USB 2.0 HUB chip OTG adapter chip Android Apple OTG peripheral chip HS8845B CPC-16

Specifications
SSOP10 encapsulation
Enhanced C51 core, with a main frequency of 48M/96M
Support USB HS/FS, enhanced USB PHY design ensures USB transmission relies on cables.
Internally integrated DLL, supporting card clocks up to SDR104 and HS100.
Supports SDSC, SDHC, and SDMC four wire read and write, with a maximum capacity of 2TB for access.
Foreign countries can streamline to 1-2 bypass capacitors.
Internally integrated high-precision RC oscillator and USB clock automatic correction controller, foreign crystal free oscillator.
Built in 5V to 3.3V and 3.3V to 18V LDOs. Built in card POWER GATE power control for card sleep and card fault recovery.
Support LED data communication indication. Supports USB automatic sleep and wake-up.
Supports GPIO wake-up (CD pin wake-up with card insertion). The maximum operating current of the system is 200mA, the idle current (without card insertion) is less than 35mA, and the standby current is less than 50uA.
ESD greater than 400oV
Working temperature -30-75 degrees.



High-Speed USB Peripheral Expansion

Boost the connectivity of your mobile devices and PCs with the HS8845B chip, engineered for seamless USB 2.0 interaction. With data transfer rates reaching 480Mbps, this OTG-compatible solution is perfect for integrating multiple peripherals, ensuring rapid and stable data flow in various consumer and commercial applications.


Robust and Durable Design

Manufactured with a durable FR-4 base, green soldermask, and a protective HASL surface finish, the HS8845B chip guarantees longevity under demanding conditions. Its impressive ESD protection and wide operating range make it ideal for devices facing challenging environments, making it a reliable choice for all your USB expansion needs.


Easy Integration and Compliance

The HS8845B chip is engineered for straightforward SMD mounting and integrates smoothly into standard panel sizes. Supporting dual voltage sources and complying with RoHS standards, it ensures eco-friendly usage while maximizing design flexibility for manufacturers, suppliers, and exporters.

FAQ's of USB 2.0 HUB chip OTG adapter chip Android Apple OTG peripheral chip HS8845B CPC-16:


Q: How is the HS8845B USB 2.0 HUB OTG adapter chip used in mobile and tablet peripheral expansion?

A: The HS8845B chip enables OTG functionality, allowing Android and Apple devices to connect to multiple USB peripherals such as keyboards, mice, and storage devices. It acts as a bridge, facilitating data communication and device expansion in a compact, integrated form.

Q: What devices are compatible with the HS8845B chip?

A: The HS8845B is compatible with Android and Apple devices that support USB OTG (On-The-Go), as well as PCs that require USB 2.0 peripheral expansion. It is ideal for smartphones, tablets, and other mobile devices requiring additional connectivity.

Q: Where is the HS8845B chip typically applied or installed?

A: This chip is widely used in mobile phones, tablets, and PCs where enhanced peripheral connectivity is desired. It is suitable for both embedded device designs and external expansion modules.

Q: When should I choose the HS8845B chip over other USB hub solutions?

A: Select the HS8845B when you need OTG support across both Android and Apple platforms, reliable high-speed data transfer, robust ESD protection, and operation in wide temperature ranges, combined with compliance to environmental standards like RoHS.

Q: What benefits does the HS8845B offer in terms of protection and durability?

A: The chip features advanced ESD protection (8kV contact, 15kV air), high insulation resistance, flame resistance (94V-0), and operates reliably from -40C to +85C. These characteristics ensure its durability and suitability for harsh or variable operating environments.

Q: How is the HS8845B chip mounted and tested during manufacturing?

A: It is designed for standard SMD (surface-mount device) methods, with a CPC-16 package and standard panel sizing. Each chip undergoes 100% E-testing, ensuring reliable performance before deployment.

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