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HS8.1 OOSP16 USB 2.0 high-speed HUB controller chip embedded with a RISC
HS8.1 OOSP16 USB 2.0 high-speed HUB controller chip embedded with a RISC

HS8.1 OOSP16 USB 2.0 high-speed HUB controller chip embedded with a RISC

Price 5.0 USD ($)/ Piece

MOQ : 1 Piece

HS8.1 OOSP16 USB 2.0 high-speed HUB controller chip embedded with a RISC Specification

  • Silkscreen
  • White Marking
  • Voltage Endurance
  • 3.3V core, 5V tolerant I/O
  • Impedance
  • Standard IC Data Lines
  • Hole Size
  • Not Applicable (IC Chip)
  • Min. Line Width
  • Not Applicable (IC Chip)
  • Test
  • Functionally Tested
  • Board Type
  • SMD IC
  • Insulation Resistance
  • 100 M
  • Flame Resistance Level
  • UL94-V0
  • Min. Line Spacing
  • Not Applicable (IC Chip)
  • Product Type
  • USB 2.0 High-Speed HUB Controller Chip
  • Base Material
  • Silicon
  • Surface Finish
  • Epoxy Molded Plastic
  • Copper Thickness
  • 35 m
  • Board Thickness
  • 1.6 mm
  • Color
  • Black
  • Panel Size
  • Standard Chip Dimensions
  • Electrical Components
  • RISC Embedded, Integrated USB PHY, PLL, Power Regulator
  • Number Of Layers
  • Multiple (Package-level)
  • Power Consumption
  • Low Power, <120 mW typical
  • Integrated Clock PLL
  • Yes
  • Operating Temperature
  • -40C to 85C (industrial grade)
  • Hot Plug Support
  • Yes
  • USB Standard
  • USB 2.0 High-Speed (480 Mbps)
  • Embedded ROM
  • Yes
  • Chip Model
  • HS8.1 OOSP16
  • RoHS Compliance
  • Yes
  • Data Rate
  • High-Speed (480 Mbps), Full/Low-Speed compatible
  • ESD Protection
  • 2000V HBM
  • Output Drive Capability
  • Up to 8mA per port
  • Core Type
  • RISC microcontroller embedded
  • Control Interface
  • I2C/SMBus
  • Number of USB Ports Supported
  • Up to 4 downstream ports
  • Power Supply Voltage
  • 3.3V (core), 5V (I/O)
  • Programmable Functions
  • EEPROM programmable configuration
  • Package Type
  • SOP-16 (Plastic)
 

HS8.1 OOSP16 USB 2.0 high-speed HUB controller chip embedded with a RISC Trade Information

  • Minimum Order Quantity
  • 1 Piece
  • FOB Port
  • Shenzhen
  • Payment Terms
  • Telegraphic Transfer (T/T)
  • Supply Ability
  • 50000000 Pieces Per Month
  • Delivery Time
  • 1 Week
  • Sample Available
  • No
  • Sample Policy
  • Contact us for information regarding our sample policy
  • Packaging Details
  • 4000 pcs per package
  • Main Export Market(s)
  • Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
  • Main Domestic Market
  • All India
  • Certifications
  • ROHS
 

About HS8.1 OOSP16 USB 2.0 high-speed HUB controller chip embedded with a RISC

1. USB 2.0 high-speed HUB controller chip, embedded with a RISC like processor, used to operate internal control/status registers and respond to USB host commands.
HS8.1 design minimizes the cost of peripheral components and BOM, and optimizes the pin layout to support single-sided and cross line layout, effectively reducing the production cost of the solution.
3. Currently widely used in computer accessories, Android phone accessories, and Apple phone accessories.
4. Fully compatible with USB 2.0 standard and backward compatible with USB 1.1 standard.
5. USB 2.0 HUB main control IC, no drive, no crystal.
6. Same board as FE8.1, PIN to PIN does not require drawing board, and can be used immediately on the board


High-Speed USB Performance

Leveraging USB 2.0 High-Speed compatibility, the HS8.1 OOSP16 delivers fast and reliable data transfer at rates up to 480 Mbps. Full and low-speed backward compatibility ensures flexibility for various devices. Ideal for users demanding stable connectivity and swift performance in multi-port USB hub applications.


RISC Microcontroller Embedded

At the core, an efficient RISC microcontroller powers advanced USB handling, enabling versatile control and data processing. Embedded ROM, EEPROM programmable functions, and an integrated clock PLL combine to provide both reliability and customization for industrial and commercial designs.


Durability and Compliance

Designed for robust industrial use, this chip endures extreme temperature ranges from -40C to 85C. ESD protection of 2000V HBM, RoHS compliance, and UL94-V0 flame resistance deliver safety and reliability, making it suitable for a range of demanding deployment scenarios.

FAQ's of HS8.1 OOSP16 USB 2.0 high-speed HUB controller chip embedded with a RISC:


Q: How do I configure the HS8.1 OOSP16 USB hub controller for custom applications?

A: The chip supports EEPROM programmable configuration, allowing users to set specific parameters and optimize behavior via I2C or SMBus interfaces using supported development tools.

Q: What benefits does the integrated RISC microcontroller provide?

A: An embedded RISC microcontroller offers efficient data processing and precise control, enabling faster response times and flexible USB hub management compared to traditional hub controllers.

Q: When is this hub controller recommended for use?

A: This chip is ideal for industrial and commercial applications requiring stable USB 2.0 high-speed connectivity, wide operating temperature, and robust ESD protection, such as factory automation, data terminals, and embedded system hubs.

Q: Where can the HS8.1 OOSP16 be sourced or purchased?

A: You can obtain the HS8.1 OOSP16 chip through authorized distributors, exporters, manufacturers, suppliers, and traders in China specializing in electronic components.

Q: What process ensures the reliability and quality of the chip?

A: Each unit undergoes functional testing and is manufactured with multiple package-level layers, adhering to industry quality standards and incorporating flame-resistant and RoHS-compliant materials.

Q: How does hot plug support enhance usability?

A: Hot plug support allows devices to be safely connected or disconnected without powering down the system, improving convenience for both end-users and technicians during installation or maintenance.

Q: What are the key benefits of low power consumption in this USB hub controller?

A: With typical power usage below 120 mW, the controller minimizes energy costs, reduces thermal output, and enables thermal management, which is critical in dense multi-port and industrial environments.

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